2013/06/27
GMI Technology Partners With STK
GMI Technology Inc. (Public, TPE: 3312) announced that they have engaged into a partnership with STK Corporation. Under the jointly signed agreement GMI will design in and distribute STK’s line of ceramic heat sink products. Target applications include networking, routers and hubs, set top boxes and TVs. Initial shipments to customers started earlier this quarter. Commenting on the announcement, Joseph Tong, GMI vice president, said, “We are very pleased to partner with a company of STK’s capabilities. They have an excellent range of proven heat sink products. Many of the end user solutions that utilize STK’s technology will be produced in mainland China where GMI is very strong.” “We are very pleased to partner with a company with GMI’s capabilities,” stated Mike Liao, STK President. “GMI’s strong engineering and sales teams and strength across Greater China will be very valuable to enable STK to reach our growth targets”.
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2013/06/12
GMI Technology Enters Security Chipset Market
GMI Technology Inc. (Public, TPE: 3312) announced that it has entered the security chipset market by partnering with Gemalto. Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with more than 13,000 employees located in 43 countries. GMI will initially target the point-of-sale (POS) and EMV banking card markets in mainland China. Commenting on the announcement, Lewis Lo, GMI President, said, “We are excited to enter this fast growing strategic market via our new partnership with Gemalto. They have an impressive range of high quality and high performance security hardware and software products. Our initial customers are very pleased with the products we have delivered.” “We are very pleased to partner with a company with GMI’s capabilities,” stated Philippe Inserra, Gemalto Vice President APAC. “GMI’s strong engineering and sales teams, and strength in Greater China will enable us to reach our aggressive growth targets”.
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2013/05/21
Toshiba to Start Mass Production of Next Generation NAND Flash Memory
- To supply the world's smallest 64-gigabit NAND memory chipon second generation 19 nanometer (nm) process technology -21 May, 2013 TOKYO—Toshiba Corporation (TOKYO: 6502) today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month. Toshiba has used the new generation technology to develop the world's smallest* 2-bit –per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimeters. Using a unique high speed writing method, the next generation chips can achieve a write speed of up to 25 megabytes a second - the world's fastest class* in 2-bit-per-cell chips. Toshiba is also developing 3-bit-per-cell chips by using this process technology and aims to start mass production in the second quarter of this fiscal year. The company will initially introduce 3-bit, multi-level-cell products for smartphones and tablets by developing a controller compatible with eMMC, and will subsequently extend application to notebook PCs by developing a controller compliant with solid state drives (SSD). NAND flash memory is an essential component of a diverse line-up of consumer products, including memory cards, smartphones, tablets and notebook PCs, and is increasingly deployed…
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2013/05/20
GMI Announces 1st Quarter Financial Results – Net Profit Up 61%
GMI Technology Inc. (Public, TPE: 3312) today announced financial results for the 1st quarter of fiscal year 2013. For the three month period ending March 31, 2013 net revenue was US $ 109.4 million, an increase of 6% versus both the prior quarter and the same quarter in 2012. After-tax net profit for the period was US$ 1.1 million, versus an after-tax net loss of US$ 282 thousand in the same quarter in 2012 and in increase of 61% over the prior quarter. Commenting on the announcement, Mr. Lewis Lo, president of GMI, said, “We are very pleased with our continued consistent revenue growth in what is traditionally a slow quarter, and our net profit results were well above our expectations. GMI also entered into several new customer and vendor partnerships during the quarter, and successfully started shipments ahead of schedule from our joint venture with Willas-Array Electronics announced last November. Despite some ongoing challenges in some sectors of the worldwide economic environment, GMI iso ptimistic about the remainder of 2013 and our long term growth.“
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2013/04/30
Winbond Top Serial Flash Memory Supplier Worldwide, Ships 1.7 Billion Units In 2012, Ramps 58nm Production
Serial Flash Leader Has Highest Revenue, Most Units Shipped in Fast-Growing Market Increasing Production of 58nm Multi-I/O SpiFlash® Memories from 32Mb to 256Mb SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – April 10, 2013 -- Winbond Electronics Corporation, a global supplier of Flash memories and inventor of the popular Multi-I/O Serial Flash architecture, today announced it is now the top supplier of Serial NOR Flash memories worldwide. Based on recent market data from WebFeet Research, Winbond took the number-one position in 2012 with 27.5 percent market share of the $1.34 billion Serial Flash market. Winbond shipped 1.7 billion Flash memories in 2012, which is 33 percent of all Serial Flash units worldwide and more than any other NOR Flash supplier. Additionally, Winbond announced it is increasing production of its 58-nanometer (58nm) SpiFlash® memories at the company’s 12-inch-wafer fabrication facility in Taichung, Taiwan, to meet growing customer demand. Winbond’s 58nm Multi-I/O SpiFlash family ranges in density from 32 megabits (Mb) to 256Mb and features the popular Serial Peripheral Interface (SPI), Dual-SPI, Quad-SPI and QPI formats. Serial Flash Market Continues to Grow “Worldwide Serial NOR Flash shipments will continue to grow from $1.34 billion in 2012 to greater than $2.6 billion by 2016,”…
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2013/04/09
AUO debut 5-inch FHD OLED smartphone display with the world's highest resolution
A Lineup of Ultra-High Resolution Displays and Innovative Display Applications will be showcased at Shenzhen's CODE 2013 AU Optronics Corp. ("AUO" or the "Company") (TAIEX: 2409; NYSE: AUO) announced that it will participate in China Information Technology Expo & China Optoelectronics Display Expo 2013 (CITE & CODE 2013) in Shenzhen from April 10 to 12. With the theme of “Experiencing the ultimate visual experience with ultra high definition” this year, AUO will demonstrate its display applications and technologies focusing on the ultra-high resolution, super narrow bezel, high performance touch solution, and diverse applications & technologies with high added value. Among them, AUO will debut the 5-inch Full HD OLED smartphone display with resolutions as high as 443 ppi (pixel per inch), the highest* resolution OLED in the world. The exhibition highlights include the 5-inch FHD OLED panel, a full lineup of smartphone applications with high resolution and super narrow bezel panels ranging from 5” to 5.7”, the 10.1” AHVA tablet display, and the 65-inch and 55-inch UHD 4K LCD TV panels. For public information displays, AUO will showcase the 55” switchable mirror display and the 65” hybrid transparent display for the vending machine. Furthermore, AUO will also exhibit…
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2013/04/08
GMI Announces 4th Quarter And Full Year 2012 Financial Results
GMI Technology Inc. (Public, TSEC: 3312) today announced financial results for their 4th quarter and fiscal year 2012. For the quarter ending December 31, 2012 net revenue was US$ 102.8 million, an increase of 3.5% versus the same quarter in 2011. For the twelve month period ending December 31, 2012 net revenue was a record US$ 428.2 million, an increase of 7.5% versus 2011, with an after-tax profit of US$ 1.3 million for the year. Over the past decade GMI’s net revenues have increased approximately 23% per year, among the leaders in their business segment. Commenting on the announcement, Mr. Lewis Lo, president of GMI said, “We are pleased to report our 6th consecutive year of annual sales growth in light of some challenges beyond our control. The worldwide economic situation has not recovered as quickly as anticipated and there was significant unexpected price erosion in some technology segments. Fortunately GMI was able to overcome these challenges with prior operational and strategic actions taken to improve our competitiveness, resulting in an after-tax net profit for the year. In addition we added valuable new customer and vendor partnerships during the year, and also entered new high growth markets. Although we remain…
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2013/03/28
GMI Enters Heat Sink Market
GMI Technology Inc. (Public, TPE: 3312) announced has entered the rapidly growing market for heat sinks. The company has partnered with XBRIGHT who will initially the technology. GMI will initially focus on delivering solution manufacturers copper heat sinks for tablet PC and smart phone applications. Initial shipments to customers started earlier this quarter. Commenting on the announcement, Joseph Tong, GMI Vice President of New Business Development, said, “We are excited to enter this emerging market via our partnership with XBRIGHT. Their technology is well proven and will enable GMI to quickly penetrate this business segment. The majority of end user solutions for this fast growing market will be produced in mainland China where GMI is very strong.”
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2013/03/13
Realtek SuperSpeed USB (USB 3.0) Hub Controllers Achieve USB-IF Certification
HSINCHU, Taiwan – March 13, 2013 – Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s largest IC design houses and a market leader in USB interface application technology, today announced the Realtek SuperSpeed USB (USB 3.0) hub controller (RTS5401) has passed USB 3.0 compliance and certification testing by the USB Implementers Forum (USB-IF). “The USB-IF is pleased that Realtek has achieved certification for its SuperSpeed USB hub controller (RTS5401),” said Jeff Ravencraft, President & COO, USB-IF. “Realtek is a USB-IF member company dedicated to USB device standardization, and their efforts support the USB-IF’s mission to expand the SuperSpeed USB ecosystem”. As the SuperSpeed USB market continues to grow at a rapid pace, hub solutions are needed to conveniently manage multiple consumer devices using USB 3.0. Realtek SuperSpeed USB hubs provide a flexible connection between the host and peripheral devices, with no sacrifice in transmission performance. The Realtek RTS5401 is an advanced USB 3.0 hub controller with up to four downstream ports and with USB Battery Charging v1.2 support. The hub is backward compatible to USB 2.0 and USB 1.1. The System-on-a-Chip (SoC) successfully integrates a Switching Regulator and Low Dropout Regulator so that low-power…
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2013/03/08
Nuvoton Announces its New eSIO Series IC – NCT6683D
Hsinchu, Taiwan, Mar. 8, 2013 － Nuvoton Technology Corporation proudly announces NCT6683D, the new eSIO series IC, which integrates traditional SIO with built-in uC or uP to provide the best green control on MB / AIO systems. The “e” of eSIO stands for the "embedded” controller based SIO. NCT6683D, combining a built-in microcontroller and traditional legacy SIO functions, supports a rich set of features and targets the All-in-One PC applications, high-end motherboard applications that need the built-in microcontroller to fulfill the customized features, server applications for BMC-lite segments, such as workstation, storage and cloud, and any other applications that microcontroller can better execute the performance. The microcontroller inside NCT6683D is the industrial standard 1T 8-bit microcontroller and the firmware code is stored in an external SPI flash, which could be updated via LPC interface or PS/2 interface with special tools provided by Nuvoton. In addition to the built-in microcontroller, the features that NCT6683D implements, such as PECI (Platform Environment Control Interface), SB-TSI interface, SMBus master, DSW (Deep Sleep Well) glue logic, power supervisor, USB host, Real Time Clock (RTC), and real time Port80 display through UART TX with Nuvoton debug card or AP, make it also the up-to-date IC for both Intel®…
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2013/02/15
GMI Announces Record Hard Disk Drive Shipments
GMI Technology Inc. today announced record shipments of hard disk drives (HDDs). For the year ending December 31st, 2012 unit shipments increased 37% from the previous year. The majority of the HDDs were sourced from Toshiba, GMI’s primary storage partner. Commenting on the announcement, Eric Wang, vice president of GMI, said, “We are extremely pleased with the continued growth in our HDD business, and are proud to be one of the fastest growing HDD providers in the rapidly growing Greater China market. In addition to our excellent unit shipment growth, we significantly increased our sales revenue from this segment. Hard disk drives are a strategic focus for GMI and complement our other consumer electronics and IT product lines well. HDDs are now our largest single product line and we continue to be very optimistic about GMI’s future growth in this segment. We greatly appreciate the outstanding support from Toshiba, our long time strategic storage partner, to enable our achievements.” "We continue to be very happy to partner with a company with GMI’s capabilities,” stated Ryusuke Kashiwabara, Toshiba Digital Media Network Marketing senior manager. “GMI’s strong engineering and sales teams, broad market coverage, and strength in Greater China will be a…
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2013/02/07
Actions Semiconductor Licenses ArterisFlexNoCInterconnect IP for Multimedia Application Processors
Actions Semiconductor leverages silicon-proven network-on-chip (NoC) technology to ease routing congestion and improve timing in next-generation tablets . SUNNYVALE, California – February 7, 2013 – Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that Actions Semiconductor Co., Ltd. (ADR) (NASDAQ:ACTS) has secured licenses for the Arteris®FlexNoC™ interconnect IPfor use in their multimedia application processors. Actions will use FlexNoC for front-end designs, ensuring that data-intensive applications such as interactive animation and high resolution video do not suffer from routing congestion or timing issues. As consumers demand tablets with multiple, real-time functions, Actions’ applications processors will meet those requirements. “At Actions Semiconductor, our goal is to provide a powerful platform with differentiated features and cost-competitive total solutions for our customers,” said Mr. Shawn Li, CTO of Actions Semiconductor. “With the ArterisFlexNoc interconnect IP, software tools and design support we have confidence our multimedia application processors will magnify their innovations and speed time to market.” “Arteris is excited that one of China’s leading fabless semiconductor companies chose our NOC interconnect IP to advance next generation technology,” said K. Charles Janac, President and CEO of Arteris. “FlexNoC will enable SoC designers to deliver cutting edge…
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2013/02/04
TOSHIBA Develops High Speed NANO FLASH™-100 Flash Memory for ARM Core Based Microcontrollers
TOKYO–Toshiba Corporation (TOKYO: 6502) today announced that it has developed NANO FLASH™-100 much faster access for embedded microcontrollers, based on Toshiba's original NANO FLASH™. Development background: The rich functionality and high speed capabilities of embedded microcontrollers require much flash memory with much faster access rates. Toshiba has recognized and responded to this by developing NANO FLASH™ which merges two features: high speed programming, based on NAND flash memory cell device technology; and NOR flash memory circuit technology. Toshiba has subsequently brought this high level performance to its original microcontrollers and to ARM core-based microcontrollers. Now, as more users use ARM core-based microcontrollers, there is an emerging need for greater speed and large memory capacities. NANO FLASH™-100 is highly suited to this market. Features: The newly developed NANO FLASH™-100 achieves a zero-wait cycle during random access at 100MHz operation (note 1), the industry's top class. This allows the core in ARM-based microcontrollers to fully utilize the superior performance and code density of applications requiring high speed and large capacity memory. Using the ultra low power technology of NANO FLASH™ microcontrollers, a wide range of high speed, low power applications developments are available. Toshiba will follow up on its first NANO FLASH™-100…
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2013/01/09
Toshiba Hybrid Drive Honored with Visionary Award at 2013 Storage Visions™
Recognized for its visionary approach and technologies in the mobile consumer storage category. TOKYO-- Toshiba Corporation (TOKYO: 6502) is pleased to announce that its MQ01ABDH hybrid drive series was awarded the Storage Visions™ Visionary Award in the Mobile Consumer Storage product category at the 12th annual Storage Visions Conference, held in Las Vegas, U.S.A. from January 6th to 7th. Storage Visions is an annual storage products technical event covering hard disk drives (HDD) and solid state drives (SSD), and the award recognizes excellence in embedded storage solutions in mobile consumer devices. Today's PCs must meet increasingly strong demands for storage capacities that can handle multiple HD videos and other data-rich sources, and deliver read/write speeds that support excellent performance. Toshiba's MQ01ABDH hybrid drive integrates NAND flash memory with a hard drive to make full use of the large capacity of the HDD and the fast data access speeds of the NAND. It also features self-learning caching algorithms that optimize performance by learning the system user's data access patterns. The Visionary Award was presented in recognition of Toshiba's innovative approach and the advanced technologies the company brought to the hybrid drive. Shipments of the MQ01ABDH series started in autumn 2012 for…
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2012/12/14
Realtek’s Hi-Fi Audio Single Chip with Voice/Sound DSP and CODEC (ALC5642) Receives ‘Innovative Product Award 2012’
HSINCHU, Taiwan – December 14, 2012 – Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s leading IC providers, today announced that its Hi-Fi Audio Single Chip with Voice/Sound DSP and CODEC (ALC5642) has received an ‘Innovative Product Award 2012’ from the Hsinchu Science Park Administration in Taiwan. The Realtek ALC5642 is the first audio single chip to integrate a Hi-Fi audio codec, high-efficiency/low-power amplifiers, and voice/sound DSP, as well as Realtek trademarked SounzReal™ sound effect technology. The high-integration and low-power architecture of the ALC5642 is designed for mobile product applications such as tablet and smartphone. Products featuring the ALC5642 will provide a high-quality voice communication experience, and excellent acoustic-fidelity and immersive audio when listening to music or watching movies etc. SounzReal™ sound effect technology includes BassBack (virtual bass), OmniSound (virtual surround), and TruTreble/Bass (Treble/Bass enhancement). The high performance Voice DSP provides wide-band level voice processing capabilities and very high voice communication quality. Built-in noise suppression, echo cancellation, and duplex capabilities all feature class-leading technologies. The voice DSP builds-in a proprietary long-range, low-noise recording technology enabling a smartphone or tablet to function as a voice recorder and camcorder. “Our ALC5642 was designed specifically to offer a top quality…
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2012/11/19
GMI Technology and Willas-Array Electronics Partner to Expand Semiconductor Business in Greater China
November 19, 2012 – GMI Technology Inc. (“GMI”), a premier Greater China electronics distributor listed on the Taiwan Stock Exchange, and Willas-Array Electronics (Holdings) Limited (“Willas-Array”), one of the largest Hong Kong based distributors of electronics components and listed on the Singapore Exchange, announced today that they have entered into a joint venture agreement. Under the agreement, a joint venture company by the name of GW Electronics Company Limited has been formed, and the company will be an authorized distributor of Toshiba Semiconductor. The major focus of this new company will be to distribute Toshiba semiconductor products in mainland China and Hong Kong. The operation of the JV is expected to start from early next year. Commenting on this announcement, Willas-Array Chairman, Mr. Lawrence Leung said, “We are delighted to be expanding our distribution business through this valued partnership with GMI Technology This will aid our company’s further expansion into our main target markets of mainland China and Hong Kong.” Mr. Lewis Lo, GMI Technology President, added, “We are very excited to align with Willas-Array in this venture. In addition to the benefits to our two companies, more importantly this will enable Toshiba to continue their semiconductor business expansion in…
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2012/11/19
Winbond Electronics Corporation Signed an NT$ 5 Billion Syndicated Loan Agreement with 10 Domestic Banks
Hsinchu, Taiwan, Nov. 19, 2012-Winbond Electronics Corporation today announced that it has signed an NT$ 5 billion three-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. James Chen, President of Chinatrust Commercial Bank at Sherwood Hotel Taipei. The main purpose of the syndication loan is to finance the term loan repayments and the working capital needs. The syndication was led by Chinatrust Commercial Bank, Taishin International Bank, First Commercial Bank, DBS Bank and participated by six other financial institutions. The loan was oversubscribed and final facility amount was closed at NT$ 5 billion. The oversubscription represents banks’ recognition of Winbond’s credit standing and positive business prospects. Winbond is a leading supplier of Specialty Memory with three major product lines including Specialty DRAM, Mobile RAM, and NOR Flash. We are able to deal with uncertainties of economic conditions and provide tier-1 customers with quality services through technology migration, balanced capacity mix of NOR Flash and DRAM products. In addition, mass production of 58nm and 46nm technologies will enhance cost competitiveness. With strong financial condition, Winbond will strive to deliver stable profitability and achieve sustainable competitive advantages in the future.
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2012/11/08
GMI Technology Announces Quarterly Financials – Net Revenue Increases 21%
GMI Technology Inc. (Public, TPE: 3312) has announced financial results for the 3rd quarter of their fiscal year 2012. For the three month period ending September 30, 2012 net revenue was a record US$ 113.4 million, an increase of 21% versus the same period in 2011. After-tax net profit for the three month period was US$ 444K, a decrease of 6.5% versus the prior quarter in 2012. For the nine month period ending September 30, 2012 net revenue was a record $US 325M an increase of 9% versus the same period in 2011. Commenting on the announcement, Lewis Lo, president of GMI Technology, said, “We are excited to once again achieve record net revenue results for both the recent quarter and on a year-to-date basis. While our net profit results were disappointing, we have taken actions to minimize the impacts of factors beyond our control coupled with numerous initiatives within our control to maximize our chances for ongoing success. Despite some continued difficulties in the worldwide economic environment, GMI Technology continues to be very optimistic about our long term future revenue and profit growth.” Detailed financials can be found on GMI Technology’s website at www.gmitec.com.
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2012/10/29
JVCKENWOOD and SYNDIANT form a strategic alliance for the development and production of Pico LCOS products
JVC KENWOOD Corporation (JVCKENWOOD), a global manufacturer specializing in electronics products, and SYNDIANT, Inc. (SYNDIANT), a leading US manufacturer of Pico Liquid Crystal On Silicon (LCOS) devices, are pleased to announce that two companies have formed a partnership to promote the development and production of LCOS products. 1. Background and purpose Since JVCKENWOOD released its first multimedia projector using the LCOS device, which is a kind of reflective liquid crystal device, in 1997, it has gained widespread recognition for projectors that achieve higher levels of brightness, resolution, contrast, and color reproducibility than conventional projectors. Its current lineup based on full high-definition (HD) includes 3D-enabled 4K2K models and 3D-enabled 8K4K models for professional use. JVCKENWOOD has been developing head-up displays (HUDs), which help make driving a car safer, taking advantage of LCOS technology accumulated over many years. In January 2012, it exhibited a prototype HUD at the 2012 International CES, held in Las Vegas, U.S. In October 2012, it completed development of a first-generation HUD, started shipments, and launched full-scale marketing activities. SYNDIANT’s breakthrough patented all-digital LCOS technology is well suited for ultra-small projection applications. SYNDIANT’s innovative architecture enables crystal clear high definition images with low power in a very small form-factor. JVCKENWOOD…
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