Partner News

4K HDR IP STB SoC (RTD1295) Realtek’s RTD1295 4K HDR IP STB solution supports Android Nougat; integrating RTL8822BEH connectivity, RTL8762 Bluetooth voice remote, and the ALC5679 smart voice assistant system. World’s Lowest Power Consumption BT5 Dual Mode Audio SoC (RTL8763B) The RTL8763B not only supports the latest Dual Mode Bluetooth (BLE/BT 5), but also has the lowest power consumption (<8mA when playing music), an open SDK platform, and High-Res audio output. World’s Smallest Size and Ultra Low Power GNSS Receiver (RTL8771B) The RTL8771B supports GPS/Glonass/Beidou and simultaneous Two Systems Reception. It comes in the world’s smallest package (QFN32 4x4) and supports very low power mode (3.3mA). It is the best solution for sport watch/wristband and headset devices. 4K HDR, HFR, Android TV Solution (RTD2871/RTD2891) The RTD2871/RTD2891 4K Smart AR (Augmented Reality)/VR (Virtual Reality) TV SoC supports HFR (High Frame Rate) 120Hz decoding, and all HDR (High Dynamic Range) standards. It integrates new AR/VR technology to lead TV users into an augmented virtual world experience.   11ac Wave 2 Wi-Fi Combo NIC Solutions (RTL8822B & RTL8821C) The RTL8822B (2x2) and RTL8821C (1x1) are 28-nanometer-process 11ac Wave 2 Wi-Fi combo solutions, providing various interfaces and module sizes to fulfill various design-in requirements.…

Winbond Introduces TrustME™ Secure Flash Memory aligned with Platform Security Architecture from Arm   2017/10/24   TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustMETM Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm.   As the industry’s first Common Criteria EAL5+ certified secure Non-Volatile Memory, now with support for PSA, the TrustMETM W75F Secure Flash enables SoC and MCU vendors to design highly secure and certifiable solutions for the Internet of Things (IoT), mobile, artificial intelligence and other demanding security applications. The foundational security principles of PSA combined with Winbond’s TrustMETM memory, provide a complete solution for secure hardware designs, trusted boot, firmware confidentiality and integrity, trusted factory initialization of devices and secured firmware updates.   With Winbond’s TrustMETM W75F technology, SoC and MCU designers can utilize any manufacturing process and connect to any Secure Flash density without being restricted to manufacturing only in process nodes capable of embedding flash memory cells. System designers can develop systems that are highly secure and scalable, in addition to being power-efficient and cost-effective.   Furthermore, Winbond’s expansion of TrustMETM W75F Secure Flash with…

Winbond Introduces TrustME™ Secure Flash Memory Implementing the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture 2017/10/24 TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustMETM Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification. As the industry’s first Common Criteria EAL5+ certified Secure Flash, and now with the addition of support for the TCG DICE, the TrustMETM W75F Secure Flash provides designers with secure memory solution for Internet of Things (IoT), mobile, artificial intelligence, and other demanding applications that call for a secure root of trust, privacy, authentication, code and data confidentiality. The proliferation of Internet-connected clients in consumer and industrial applications increases privacy and security challenges, which can limit the growth of IoT deployments. While the innovation and application of connected things will continue, establishing root of trust and data confidentiality are some of the biggest concerns designers need to consider when developing new connected devices. TCG DICE Architectures defines new security and privacy technologies applicable to systems and components. The goal is to provide new approaches to enhancing security and…

AUO Presents World's Largest 8K4K Bezel-less TV Display World's first series of professional and gaming monitor panels equipped with advanced HDR technology Published date: 2017-09-19 AU Optronics Corp. ("AUO" or the "Company") (TAIEX: 2409; NYSE: AUO) will participate in Touch Taiwan 2017 at Taipei Nangang Exhibition Center from September 20 to 22 to showcase a full lineup of advanced large-sized display technologies and products. Exhibition highlights include enhanced ALCD technology with advanced HDR (high dynamic range) introduced to the full series, including the world’s largest(*) 85-inch 8K4K (7680 x 4320), and 65-inch and 75-inch UHD 4K (3840 x 2160) bezel-less ALCD TV displays; the world’s first(*) 27-inch and 35-inch gaming monitor panels equipped with advanced HDR technology; and a variety of public information display solutions featuring high resolution, high brightness, extreme narrow bezel and stretched type, which could be tailored to customer requirements to support content of diverse kinds to be eminently displayed in varied environments. Enhanced ALCD Technology for Ultimate Home Theater Audio-Visual ExperienceAUO continues to strengthen its technology edge of high contrast and wide color gamut by presenting an enhanced version of ALCD technology. Through a comprehensive HDR design, the display can achieve as high as 2000-nit brightness…

AUO Leads in LTPS Technology Platform with Series of High-End Mobile Device Displays Making Glamorous Debut Large-sized, ultra high resolution and ultra slim border notebook PC displays, and 18:9 full screen smartphone displays outlining the new style of entertainment and life Published date: 2017-09-18 AU Optronics Corp. ("AUO" or the "Company") (TAIEX: 2409; NYSE: AUO) today announced its participation to Touch Taiwan 2017 from September 20 to 22. This year the exhibition highlights include AUO’s full range of LTPS displays, demonstrating the Company’s accomplishments in the field. UHD 4K ultra narrow border LTPS notebook PC panels, UHD 4K LTPS notebook PC panels integrating oTP touch function, and 18:9 full screen LTPS in-cell touch panels for smartphone will make their dazzling appearance in rich and diverse product portfolio, creating an astounding all new experience in the smart mobile life. The LTPS technology enables the panel to demonstrate four core strengths including high resolution, ultra narrow border, high screen-to-body ratio, and low power consumption simultaneously. AUO has accumulated profound strengths in developing and mass producing LTPS products, proactively building a robust LTPS technology platform and deploying in mid to high-end markets. In addition to notebook PC and smartphone displays, LTPS technology has…

HSINCHU, Taiwan – January 04, 2017 – Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s leading network and multimedia IC providers, will be demonstrating a full range of connectivity, multimedia, and consumer electronics solutions at 2017 CES. Featured products include: Automotive Surround View Monitoring System with Low-Lux Imaging Capability (RTL9020A)The RTL9020A is the world’s first highly-integrated multimedia and Ethernet SoC designed for automotive standard AEC-Q100 Grade 2 applications. It offers ultra-low power consumption, smallest package size, and the greatly reduced RBOM inherent in a System-on-a-Chip (SoC) design. Cost-Effective Wi-Fi IoT SoC (RTL8711BN, RTL8710BN)Realtek’s RTL8711BN/RTL8710BN SoC comes in a miniature module package size (5x5 QFN). It provides simultaneous connection to multiple cloud services and features eXecute In Place (XIP), run-time security, and code flash protection. Voice Control System for Smart Home (RTL8197FS, RTL8195AM, RTL8711AM)Realtek provides turnkey solutions for intelligent voice control systems, including voice command center and home appliance’s direct voice interaction in smart homes. It operates with mainstream audio codec chips and supports Amazon’s Alexa Voice Service (AVS) and the Alexa Skills Kit (ASK) platform, as well as other third-party voice service programs. Far-Field Voice Recognition Solution (ALC5679)The Realtek ALC5679 has built-in dual DSPs and highly integrated…

TOKYO—Toshiba Corporation (TOKYO: 6502) today announced that the MQ01ABUxxxBW series, a mobile-grade thin 7mm hard disk drive (HDD) with self-encrypting technology, including Toshiba's unique wipe technology, which automatically erases data when an HDD is accessed by an unregistered system, has achieved validation to U.S. Federal Information Processing Standard 140-2 (FIPS 140-2). This is the first Toshiba self-encrypting drive (SED) validated to the FIPS 140-2 standard. Toshiba's SED models are designed to the Trusted Computing Group's (TCG) industry-standard "Opal" Security Sub-Classification. This globally accepted standard, implements protocols created to help IT managers, security management application providers and client security professionals to better manage data security and to help prevent potentially damaging and costly breaches to sensitive information. The FIPS-validated model also provides tamper-evident labeling for additional security, with a resulting validation to Level 2 of the FIPS 140-2 standard. The 7mm mobile thin SED series underwent rigorous cryptographic module validation testing by a U.S. National Institute of Standards and Technology (NIST)-certified testing laboratory in order to be validated by the U.S. Federal Information Processing standard. As a result of this validation, this Toshiba HDD series is now available for use in highly regulated and security-sensitive storage applications, such as government systems.…

ZHUHAI, China and MOBILE WORLD CONGRESS, Barcelona, Spain – 24 February, 2014 – Imagination Technologies (IMG.L) and Actions Semiconductor Co., Ltd. (Nasdaq: ACTS), one of China’s leading fabless semiconductor companies, are extending their collaboration in bringing advanced graphics to a range of Actions’ OWL chipsets which are designed to address each segment of the tablet market. Actions is leveraging Imagination’s PowerVR graphics in multiple generations of its OWL chipsets, including ATM7021, ATM7039 and ATM7029B, and will continue to use PowerVR for future generations.Already reaching significant volume shipments following its release six months ago, Actions’ ATM7021 chipset leverages a PowerVR SGX540 GPU, and brings advanced performance and multimedia capabilities to entry-level tablets. The company’s high-performance ATM7039 chipset, featuring a PowerVR SGX544MP GPU and dual channel 64-bit DDR, offers a high level of performance for high-end Android tablets. Actions’ newest quad-core solution, the ATM7029B, features a PowerVR SGX540 GPU and supports Android 4.4. Built in MIPI, the ATM7029B offers an attractive price-to-performance ratio for the mid-range market. With PowerVR, Actions is using the industry’s leading graphics processors that enable a powerful and flexible solution for all forms of multimedia processing. APIs such as OpenGL ES, OpenCL, RenderScript and FilterScript enable developers to unlock…

HSINCHU, Taiwan – November 13, 2013 –Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s leading network and multimedia IC providers, today announced that its Low Power USB 3.0-to-Gigabit Ethernet Controller (RTL8153) has been awarded the EDN China Innovation Award 2013. Products were evaluated and chosen by EDN China judges, and individual readers of EDN China were also invited to vote for their favorite product.   Realtek’s RTL8153 USB 3.0-to-Gigabit Ethernet controller targets Ultrabook, Tablet, and Motherboard applications, and supports the latest features. Realtek has applied state-of-the-art power saving technology (including IEEE 802.3az Energy Efficient Ethernet) to the RTL8153, and has achieved very low power consumption. The RTL8153’s 5V to 3.3V linear regulator takes USB bus power directly, with no requirement for an external switching regulator. Built-in OTP memory eliminates external EEPROM, and only a single 25MHz clock input is required. Realtek also provides the complete HDK, SDK, and reference component list to customers to help speed their design. The RTL8153 supports the latest power saving scheme ‘LPM/LTM’, which is ideal for the Intel Shark Bay platform and for AOAC for Windows 8 from Microsoft.The RTL8153 also supports driver-free installation for various Operating Systems, including Android (Linux), and MAC OS…

In order to meet the changing market, Giantec launched the first Serial Flash product. This product has the better performance than other competitor product. The 1M cycling endurance is over 5-10 times than the like product. And this erase time is much shorter than the like product. The special page erase function can extend the product life at least 16 times. The smallest write/erase power consumption can save more energy.

Ultra high resolution, innovative value-added applications and integrated touch solutions all on display at Touch Taiwan 2013Hsinchu, Taiwan, AU Optronics Corp. ("AUO" or the "Company") (TAIEX: 2409; NYSE: AUO), the world's leading provider of optoelectronic solutions, today announced its participation to Touch Taiwan 2013 (International Touch Panel and Optical Film Exhibition 2013) from August 28 to 30. With “Picture the Future with Innovation” being the theme, AUO will showcase a variety of ultra high resolution, innovative value-added display applications, and high efficiency integrated touch solutions to unveil a touch of the future with cutting edge display technologies. In terms of high-end TV applications, AUO will showcase 65 and 55-inch UHD 4K Wide Color Gamut TV Panels offering ultra high resolution, fine and stereoscopic images. Highlights at Touch Taiwan 2013 also include: the world's largest(*) 6.5-inch Full HD OGS Touch Panel for smartphone; 55-inch Super Slim Dual Side Display on its debut; 5 to 6.5-inch large-sized smartphone displays with HD720 and Full HD ultra high resolution; ultra slim, ultra high resolution and flexible AMOLED smartphone displays; Embedded Touch Panel (eTP) offering standardized integrated touch solutions for touch-enabled notebook PCs; a series of ultra slim and high resolution displays for tablet applications.…

TOKYO–Toshiba Corporation (TOKYO: 6502) today announced that it will provide the technical information to the developers of apps and services for "FlashAir™", the SDHC memory card with embedded wireless LAN functionality, through a technical information website "FlashAir Developers", operated by Fixstars Corporation. "FlashAir Developers" will feature application programming interface (API) information for enabling transfers of files stored on "FlashAir" cards to Wi-Fi devices. It will also offer tutorials and sample codes for developing apps, plus an extensive FAQ and a developers forum. Users will be able to develop apps and services for "FlashAir" by using the API information on the website. About "FlashAir Developers"●Release date: August 1, 2013 ●URL: https://www.flashair-developers.com/●Operation: Fixstars Corporation About "FlashAir™"●"FlashAir™" is an SDHC Memory Card that incorporates a wireless LAN chip set plus antenna for wireless communications. The Card supports wireless sharing and transfers of photos from digital cameras to smartphones, tablets and other digital devices.

AU Optronics Corp. ("AUO" or the "Company") (TAIEX: 2409; NYSE: AUO) today presents its CSR achievements in 2012, illustrating the fruits and efforts from continuous interaction with all the stakeholders. AUO CSR Report 2012 has been independently verified by a third party, winning GRI/G3.1 Level A+ (1) recognition for six consecutive years. Meanwhile, AUO also met AA1000AS (2) standards six years in a row. AUO has been devoting an all-out effort to the implementation of corporate social responsibility, maintaining high transparency and credibility in the information disclosure of sustainability indexes including economic, environmental and social aspects. Valuable inputs are gathered from the well-informed stakeholders to proactively develop green and innovative solutions. In 2012, AUO successfully met the target of reducing product carbon footprints by 30%(3). AUO also garnered the first ISO 14045 product eco-footprint certification in the world and its innovative low-carbon packaging design also won the red dot design award. In terms of education and promotion of green concepts, AUO launched the three-year Green Ark Program in 2012. Apart from continuing to practice green innovation within the Company, AUO helped shape energy-saving and zero waste mindset by organizing school competitions and seminars to share experiences and inspire more young…

(USB 2.0/Fast Ethernet & USB 3.0/Gigabit Ethernet Controllers) HSINCHU, Taiwan – July 02, 2013 – Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s leading network and multimedia IC providers, announced today its USB 3.0-to-Gigabit Ethernet controller. The RTL8153 will target Ultrabook, Tablet, IPC, and Motherboard applications, and supports the latest system platforms and features. Alongside ultra low power consumption and package size, the RTL8153 also offers simplified design-in with very low RBOM. It is pin-to-pin compatible with the current USB2.0-to-10/100M RTL8152B.Realtek also provides an industrial version of the USB3.0 GbE Controller (RTL8153I) that meets heavier demands required for industrial use and features increased operating temperature range (-40 to 85°C) and support for IEEE 1588.   The feature rich RTL8152B/RTL8153 USB-to-Ethernet controllers support the latest power saving scheme ‘LPM/LTM’, which is ideal for the Intel Shark Bay platform and for AOAC for Windows 8 from Microsoft. Realtek USB to Ethernet Controllers support driver-free installation for various Operating Systems, including Android (Linux), and MAC OS via built-in CDC ECM technology, as well as inbox driver support for Windows 8.1. Realtek has applied state-of-the-art power saving technology (including IEEE 802.3az Energy Efficient Ethernet) to both the RTL8152B and RTL8153, and has achieved…

- To supply the world's smallest 64-gigabit NAND memory chipon second generation 19 nanometer (nm) process technology -21 May, 2013 TOKYO—Toshiba Corporation (TOKYO: 6502) today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month. Toshiba has used the new generation technology to develop the world's smallest* 2-bit –per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimeters. Using a unique high speed writing method, the next generation chips can achieve a write speed of up to 25 megabytes a second - the world's fastest class* in 2-bit-per-cell chips. Toshiba is also developing 3-bit-per-cell chips by using this process technology and aims to start mass production in the second quarter of this fiscal year. The company will initially introduce 3-bit, multi-level-cell products for smartphones and tablets by developing a controller compatible with eMMC, and will subsequently extend application to notebook PCs by developing a controller compliant with solid state drives (SSD). NAND flash memory is an essential component of a diverse line-up of consumer products, including memory cards, smartphones, tablets and notebook PCs, and is increasingly deployed…

Serial Flash Leader Has Highest Revenue, Most Units Shipped in Fast-Growing Market   Increasing Production of 58nm Multi-I/O SpiFlash® Memories from 32Mb to 256Mb   SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – April 10, 2013 -- Winbond Electronics Corporation, a global supplier of Flash memories and inventor of the popular Multi-I/O Serial Flash architecture, today announced it is now the top supplier of Serial NOR Flash memories worldwide.  Based on recent market data from WebFeet Research, Winbond took the number-one position in 2012 with 27.5 percent market share of the $1.34 billion Serial Flash market. Winbond shipped 1.7 billion Flash memories in 2012, which is 33 percent of all Serial Flash units worldwide and more than any other NOR Flash supplier. Additionally, Winbond announced it is increasing production of its 58-nanometer (58nm) SpiFlash® memories at the company’s 12-inch-wafer fabrication facility in Taichung, Taiwan, to meet growing customer demand. Winbond’s 58nm Multi-I/O SpiFlash family ranges in density from 32 megabits (Mb) to 256Mb and features the popular Serial Peripheral Interface (SPI), Dual-SPI, Quad-SPI and QPI formats.   Serial Flash Market Continues to Grow   “Worldwide Serial NOR Flash shipments will continue to grow from $1.34 billion in 2012 to greater than $2.6 billion by 2016,”…

A Lineup of Ultra-High Resolution Displays and Innovative Display Applications will be showcased at Shenzhen's CODE 2013   AU Optronics Corp. ("AUO" or the "Company") (TAIEX: 2409; NYSE: AUO) announced that it will participate in China Information Technology Expo & China Optoelectronics Display Expo 2013 (CITE & CODE 2013) in Shenzhen from April 10 to 12. With the theme of “Experiencing the ultimate visual experience with ultra high definition” this year, AUO will demonstrate its display applications and technologies focusing on the ultra-high resolution, super narrow bezel, high performance touch solution, and diverse applications & technologies with high added value.  Among them, AUO will debut the 5-inch Full HD OLED smartphone display with resolutions as high as 443 ppi (pixel per inch), the highest* resolution OLED in the world.   The exhibition highlights include the 5-inch FHD OLED panel, a full lineup of smartphone applications with high resolution and super narrow bezel panels ranging from 5” to 5.7”, the 10.1” AHVA tablet display, and the 65-inch and 55-inch UHD 4K LCD TV panels. For public information displays, AUO will showcase the 55” switchable mirror display and the 65” hybrid transparent display for the vending machine. Furthermore, AUO will also exhibit…

HSINCHU, Taiwan – March 13, 2013 – Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s largest IC design houses and a market leader in USB interface application technology, today announced the Realtek SuperSpeed USB (USB 3.0) hub controller (RTS5401) has passed USB 3.0 compliance and certification testing by the USB Implementers Forum (USB-IF).   “The USB-IF is pleased that Realtek has achieved certification for its SuperSpeed USB hub controller (RTS5401),” said Jeff Ravencraft, President & COO, USB-IF. “Realtek is a USB-IF member company dedicated to USB device standardization, and their efforts support the USB-IF’s mission to expand the SuperSpeed USB ecosystem”.   As the SuperSpeed USB market continues to grow at a rapid pace, hub solutions are needed to conveniently manage multiple consumer devices using USB 3.0. Realtek SuperSpeed USB hubs provide a flexible connection between the host and peripheral devices, with no sacrifice in transmission performance.   The Realtek RTS5401 is an advanced USB 3.0 hub controller with up to four downstream ports and with USB Battery Charging v1.2 support. The hub is backward compatible to USB 2.0 and USB 1.1. The System-on-a-Chip (SoC) successfully integrates a Switching Regulator and Low Dropout Regulator so that low-power…

Hsinchu, Taiwan, Mar. 8, 2013 － Nuvoton Technology Corporation proudly announces NCT6683D, the new eSIO series IC, which integrates traditional SIO with built-in uC or uP to provide the best green control on MB / AIO systems. The “e” of eSIO stands for the "embedded” controller based SIO. NCT6683D, combining a built-in microcontroller and traditional legacy SIO functions, supports a rich set of features and targets the All-in-One PC applications, high-end motherboard applications that need the built-in microcontroller to fulfill the customized features, server applications for BMC-lite segments, such as workstation, storage and cloud, and any other applications that microcontroller can better execute the performance. The microcontroller inside NCT6683D is the industrial standard 1T 8-bit microcontroller and the firmware code is stored in an external SPI flash, which could be updated via LPC interface or PS/2 interface with special tools provided by Nuvoton. In addition to the built-in microcontroller, the features that NCT6683D implements, such as PECI (Platform Environment Control Interface), SB-TSI interface, SMBus master, DSW (Deep Sleep Well) glue logic, power supervisor, USB host, Real Time Clock (RTC), and real time Port80 display through UART TX with Nuvoton debug card or AP, make it also the up-to-date IC for both Intel®…

Actions Semiconductor leverages silicon-proven network-on-chip (NoC) technology to ease routing congestion and improve timing in next-generation tablets . SUNNYVALE, California – February 7, 2013 – Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that Actions Semiconductor Co., Ltd. (ADR) (NASDAQ:ACTS) has secured licenses for the Arteris®FlexNoC™ interconnect IPfor use in their multimedia application processors. Actions will use FlexNoC for front-end designs, ensuring that data-intensive applications such as interactive animation and high resolution video do not suffer from routing congestion or timing issues. As consumers demand tablets with multiple, real-time functions, Actions’ applications processors will meet those requirements. “At Actions Semiconductor, our goal is to provide a powerful platform with differentiated features and cost-competitive total solutions for our customers,” said Mr. Shawn Li, CTO of Actions Semiconductor. “With the ArterisFlexNoc interconnect IP, software tools and design support we have confidence our multimedia application processors will magnify their innovations and speed time to market.” “Arteris is excited that one of China’s leading fabless semiconductor companies chose our NOC interconnect IP to advance next generation technology,” said K. Charles Janac, President and CEO of Arteris. “FlexNoC will enable SoC designers to deliver cutting edge…