{"id":1899,"date":"2022-05-27T16:29:56","date_gmt":"2022-05-27T08:29:56","guid":{"rendered":"http:\/\/www.gmitec.com\/winbond\/"},"modified":"2024-07-17T15:04:42","modified_gmt":"2024-07-17T07:04:42","slug":"winbond","status":"publish","type":"page","link":"https:\/\/www.gmitec.com\/en\/agent-products\/winbond\/","title":{"rendered":"Winbond"},"content":{"rendered":"
Winbond<\/div><\/section>

About us<\/p>\n

<\/h2>\"winbond-logo\"

<\/p>\n

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarters in Central Taiwan Science Park, Taichung, Taiwan.
Winbond is a specialty memory IC company engaged in design, manufacturing and sales services. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele top quality low to medium density memory solutions.
Winbond's major product lines include Code Storage Flash Memory, Specialty DRAM and Mobile DRAM. Our advantage of technological autonomy and prudent capacity strategy enables us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building the brand image.<\/p>\n

<\/div>

http:\/\/www.winbond.com.tw
\n<\/a><\/h4>
<\/span>

Mobile DRAM<\/h2><\/span><\/div><\/section>

MobileDRAM
\n<\/h2>
<\/p>\n