1.0GMIhttps://www.gmitec.com/en/Winbond Electronics Corporation Signed an NT$ 5 Billion Syndicated Loan Agreement with 10 Domestic Banks | GMIrich600338<blockquote class="wp-embedded-content" data-secret="WjwACK1R9D"><a href="https://www.gmitec.com/en/partner-news-en/4752/">Winbond Electronics Corporation Signed an NT$ 5 Billion Syndicated Loan Agreement with 10 Domestic Banks</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://www.gmitec.com/en/partner-news-en/4752/embed/#?secret=WjwACK1R9D" width="600" height="338" title="“Winbond Electronics Corporation Signed an NT$ 5 Billion Syndicated Loan Agreement with 10 Domestic Banks” — GMI" data-secret="WjwACK1R9D" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript">
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Hsinchu, Taiwan, Nov. 19, 2012-Winbond Electronics Corporation today announced that it has signed an NT$ 5 billion three-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. James Chen, President of Chinatrust Commercial Bank at Sherwood Hotel Taipei. The main purpose of the syndication loan ishttps://www.gmitec.com/wp-content/uploads/2022/05/logo-new.png19070